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Número de pieza | CHR2295 | |
Descripción | 24-30GHz Integrated Down Converter | |
Fabricantes | United Monolithic Semiconductors | |
Logotipo | ||
Hay una vista previa y un enlace de descarga de CHR2295 (archivo pdf) en la parte inferior de esta página. Total 6 Páginas | ||
No Preview Available ! CHR2295
24-30GHz Integrated Down Converter
GaAs Monolithic Microwave IC
Description
LO
The CHR2295 is a multifunction chip which
integrates a LO time two multiplier, a balanced
cold FET mixer, and a RF LNA. It is designed for
a wide range of applications, typically commercial
communication systems. The backside of the
chip is both RF and DC grounds. This helps
simplify the assembly process.
The circuit is manufactured with a PM-HEMT
process, 0.25µm gate length, via holes through
the substrate, air bridges and electron beam
gate lithography.
It is available in chip form.
GM
GB
VDM
VDL
GX
VGA
Main Features
RF
Q
I
• Broadband performances : 24-30GHz
• 11 dB conversion gain
• 3.5.0dB noise figure
• 10dBm LO input power
• -10dBm RF input power (1dB gain comp.)
• Low DC power consumption, [email protected]
• Chip size : 2.49 X 1.97 X 0.10 mm
Main Characteristics
Tamb. = 25°C
Parameter
12.00
8.00
4.00
0.00
-4.00
Gc_channel_sup_rf+
Gc_channel inf_rf-
Gc_channel_inf_rf+
Gc_channel_sup_rf-
-8.00
-12.00
-16.00
-20.00
-24.00
22.5 23.5 24.5 25.5 26.5 27.5 28.5 29.5 30.5 31.5
2XLO Frequency (GHz)
Conversion Gain & Image suppression @ IF=1.5GHz
(including test board losses)
32.5
Min Typ Max Unit
FRF RF frequency range
FLO LO frequency range
FIF IF frequency range
Gc Conversion gain
24
12
0.25
11
30 GHz
15 GHz
1.5 GHz
dB
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
Ref. : DSCHR22951201 -20-July-01
1/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
1 page 24-30GHz MFC Down Converter
Chip Assembly and Mechanical Data
LO
IN
To Vgm DC Gate Supply
To Vgb DC Gate Supply
CHR2295
Q
OUT
To Vdm,Vdl DC Drain Supply
To Vgx DC Gate Supply
To Vga DC Gate Supply
RF
IN
I
OUT
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : : DSCHR22951201 -20-July-01
5/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09
5 Page |
Páginas | Total 6 Páginas | |
PDF Descargar | [ Datasheet CHR2295.PDF ] |
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