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PDF CHR2291 Data sheet ( Hoja de datos )

Número de pieza CHR2291
Descripción 12-17GHz Integrated Down Converter
Fabricantes United Monolithic Semiconductors 
Logotipo United Monolithic Semiconductors Logotipo



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No Preview Available ! CHR2291 Hoja de datos, Descripción, Manual

CHR2291
12-17GHz Integrated Down Converter
GaAs Monolithic Microwave IC
Description
LO
The CHR2291 is a multifunction chip which
integrates a LO time two multiplier, a balanced
cold FET mixer, and a RF LNA. It is designed for
a wide range of applications, typically commercial
communication systems. The backside of the
chip is both RF and DC grounds. This helps
simplify the assembly process.
The circuit is manufactured with a PM-HEMT
process, 0.25µm gate length, via holes through
the substrate, air bridges and electron beam
gate lithography.
It is available in chip form.
GM
GB
VDM
VDL
GX
VGA
Q
I
RF
Main Features
Broadband performances : 12-17GHz
10 dB conversion gain
3.5dB noise figure
10dBm LO input power
-8dBm RF input power (1dB gain comp.)
Low DC power consumption, [email protected]
Chip size : 2.49 X 2.13 X 0.10 mm
Main Characteristics
Tamb. = 25°C
Parameter
Typical on wafer measurement:
Conversion Gain & Image suppression @ IF=1& 1.5GHz
14
12
10
8 2LO Frequency
6
4
2
0
-2
-4
-6
-8
-10
-12
-14
-16
11,0 12,0 13,0 14,0 15,0 16,0 17,0 18,0
RF Frequency (GHz)
Min Typ Max Unit
FRF RF frequency range
12 17
FLO LO frequency range
5.25 7.75
FIF IF frequency range
0.25
1.5
Gc Conversion gain
+10
ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions !
GHz
GHz
GHz
dB
Ref. : DSCHR22912218 06-Aug.-02
1/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

1 page




CHR2291 pdf
12-17GHz Integrated Down Converter CHR2291
Chip Assembly and Mechanical Data
LO
IN
To Vgm DC Gate Supply
To Vgb DC Gate Supply
Q
OUT
To Vdm,Vdl DC Drain Supply
To Vgx DC Gate Supply
To Vga DC Gate Supply
RF
IN
I
OUT
Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended
Bonding pad positions
( Chip thickness : 100µm. All dimensions are in micrometers )
Ref. : DSCHR22912218 06-Aug.-02
5/6 Specifications subject to change without notice
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09

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