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PDF VIB0003TFJ Data sheet ( Hoja de datos )

Número de pieza VIB0003TFJ
Descripción Bus Converter
Fabricantes VICOR Corporation 
Logotipo VICOR Corporation Logotipo



Total 16 Páginas
		
VIB0003TFJ Hoja de datos, Descripción, Manual
VIB0003TFJ
BCMTM
DC to DC
Bus Converter Module
PRELIMINARY DATASHEET
S
C NRTL US
FEATURES
352 Vdc – 44 Vdc 325 W Bus Converter Module
High efficiency (>95%) reduces system power
consumption
High power density (>1000 W/in3)
reduces power system footprint by >40%
“Full Chip” VI Chip package enables surface mount,
low impedance interconnect to system board
Contains built-in protection features: undervoltage,
overvoltage lockout, overcurrent protection, short
circuit protection, overtemperature protection.
Provides enable/disable control, internal temperature
monitoring
ZVS/ZCS Resonant Sine Amplitude Converter topology
Can be paralleled to create multi-kW arrays
TYPICAL APPLICATIONS
High End Computing Systems
Automated Test Equipment
Telecom Base Stations
High Density Power Supplies
Communications Systems
DESCRIPTION
The VI Chip Bus Converter Module is a high efficiency (>95%)
Sine Amplitude Converter (SAC)TM operating from a 330 to 365
Vdc primary bus to deliver an isolated 41.25 – 45.63 V nominal,
unregulated secondary. The SAC offers a low AC impedance
beyond the bandwidth of most downstream regulators, mean-
ing that input capacitance normally located at the input of a
regulator can be located at the input to the SAC. Since the K
factor of the VIB0003TFJ is 1/8, that capacitance value can be
reduced by a factor of 64x, resulting in savings of board area,
materials and total system cost.
The VIB0003TFJ is provided in a VI Chip package compatible
with standard pick-and-place and surface mount assembly
processes. The VI Chip package provides flexible thermal
management through its low junction-to-case and junction-to-
board thermal resistance. With high conversion efficiency the
VIB0003TFJ increases overall system efficiency and lowers
operating costs compared to conventional approaches.
VIN = 330 – 365 V
POUT = 325 W(NOM)
VOUT = 41.25 – 45.63 V (NO LOAD) K = 1/8
TYPICAL APPLICATION
enable / disable
switch
SW1
F1
VIN
C1 1 µF
PC
TM
BCM
+In +Out
-In -Out
PR
PC
TM
IL
PRM
VC
SG
OS
CD
+In +Out
-In -Out
VC
PC
TM
VTM
+In +Out
-In -Out
L
O
A
D
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.2
9/2009
Page 1 of 16

1 page

VIB0003TFJ pdf
VIB0003TFJ
PRELIMINARY DATASHEET
1.1 APPLICATION CHARACTERISTICS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
No Load Power
Inrush Current Peak
Efficiency (Ambient)
Efficiency (Hot – 100°C)
Output Resistance (-40°C)
Output Resistance (25°C)
Output Resistance (100°C)
Output Voltage Ripple
VOUT Transient (Positive)
VOUT Transient (Negative)
Undervoltage Lockout
Response Time Constant
Output Overcurrent
Response Time Constant
Overvoltage Lockout
Response Time Constant
TM Voltage (Ambient)
SYMBOL
PNL
INR_P
η
η
ROUT
ROUT
ROUT
VOUT_PP
VOUT_TRAN+
VOUT_TRAN-
TUVLO
CONDITIONS / NOTES
VIN = 352 V, PC enabled; See Figure 1
COUT = 100 µF, POUT = 325 W
VIN = 352 V, POUT = 325 W
VIN = 352 V, POUT = 325 W
VIN = 352 V
VIN = 352 V
VIN = 352 V
COUT = 0 uF, POUT = 325 W @ VIN = 352,
VIN = 352 V
IOUT_STEP = 0 TO 7.7 A,
ISLEW >10 A/us; See Figure 11
IOUT_STEP = 7.7 A to 0 A,
ISLEW > 10 A/us; See Figure 12
TOCP
10 < IOCP < 15 A
TOVLO
VTM_AMB
TJ 27°C
TYP
6.5
2
95.7
95.3
115
140
190
192
3.2
2.8
150
7.5
120
3
UNIT
W
A
%
%
mΩ
mΩ
mΩ
mV
mV
mV
µs
ms
µs
V
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.2
9/2009
Page 5 of 16

5 Page

VIB0003TFJ arduino
4.0 OPERATING
VIB0003TFJ
PRELIMINARY DATASHEET
Figure 16 – Timing diagram
v i c o r p o w e r. c o m
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Rev. 1.2
9/2009
Page 11 of 16

11 Page


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