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PDF NAND02GAH0L Data sheet ( Hoja de datos )
| Número de pieza | NAND02GAH0L | |
| Descripción | NAND flash memories | |
| Fabricantes | Numonyx | |
| Logotipo |  |
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NAND02GRH0L
NAND02GAH0L NAND08GAH0N
256-Mbyte, 1-Gbyte, 1.8 V/3.3 V supply,
NAND flash memories with MultiMediaCard™ interface
Preliminary Data
Features
■ Packaged NAND flash memory with
MultiMediaCard interface
■ 256 Mbytes and 1 Gbyte of formatted data
storage
■ eMMC/MultiMediaCard system specification,
compliant with V4.3
■ Full backward compatibility with previous
MultiMediaCard system specification
■ Bus mode
– High-speed MultiMediaCard protocol
– Three different data bus widths:1 bit, 4 bits,
8 bits
– Data transfer rate: up to 52 Mbyte/s
■ Operating voltage range:
– VCCQ =1.8 V/3.3 V
– VCC = 1.8 V for NAND02GRH0L
– VCC = 3.3 V for NAND02GAH0L and
NAND08GAH0N
■ Multiple block read (x8 at 52 MHz):
up to 12 Mbyte/s
■ Multiple block write (x8 at 52 MHz):
up to 6.5 Mbyte/s
■ Power dissipation
– Standby current: down to 90 µA (typ)
– Read current: down to 20 mA (typ)
– Write current: down to 80 mA (typ)
LFBGA169
LFBGA169 12 x 16 x 1.4 mm (ZA)
LFBGA153
LFBGA153 11.5 x 13 x 1.3 mm (ZC)
■ Error free memory access
– Internal error correction code
– Internal enhanced data management
algorithm (wear levelling, bad block
management, garbage collection)
■ Host to make sudden power failure safe-update
operations for data content
■ Security
– Password protection of data
– Built-in write protection
■ Boot
– Simple boot sequence method
■ Power save
– Enhanced power saving method by
introducing sleep functionality
Table 1. Device summary
Root part number
Density
Operating voltage
Package Temperature range
NAND02GRH0L(1)
NAND02GAH0L
NAND08GAH0N
256 Mbytes
256 Mbytes
1 Gbyte
VCC = 1.8 V, VCCQ = 1.8 V/3.3 V
VCC = 3.3 V, VCCQ = 1.8 V/3.3 V
VCC = 3.3 V, VCCQ = 1.8 V/3.3 V
–
LFBGA153
LFBGA169
-25 to 105 °C
-25 to 85 °C
-25 to 85 °C
1. The NAND02GRH0L is only available as part of a combined product (eMMC combined with one or more flash memories).
March 2009
Rev 3
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to
change without notice.
1/33
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1
1 page  
NAND02GRH0L, NAND02GAH0L, NAND08GAH0N
List of figures
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Device block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
LFBGA169 package connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . . 9
LFBGA153 package connections (top view through package) . . . . . . . . . . . . . . . . . . . . . . 10
Form factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Memory array structure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Power-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Power cycling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
LFBGA169 12 x 16 x 1.4 mm 132+21+16 3R14 - 0.50 mm, package outline . . . . . . . . . . 27
LFBGA153 11.5 x 13 x 1.3 mm 132 + 21 3R14 - 0.50 mm, package outline . . . . . . . . . . . 29
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NAND02GRH0L, NAND02GAH0L, NAND08GAH0N
Device physical description
3.2 Form factor
The ball diameter, d, and the ball pitch, p, for the LFBGA169 and LFBGA153 packages are:
● d = 0.30 mm (solder ball diameter)
● p = 0.5 mm (ball pitch)
Figure 4. Form factor
VCCQ VSSQ
NC
NC
NC
dp
AI13627
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